Tasks and Responsibilities:

• CMP expert / process engineer in the LED development department
• Proactive process development of optoelectronic devices for manufacturing, specialized in damage-free Chemical Mechanical Polishing (CMP) and the relevant supporting processes like post-CMP wafer cleaning
• Development and transfer of cost-efficient, fully automated and robust processes in the thinning/polishing area for high volume wafer production
• Process enhancements at existing semiconductor tools including the evaluation and introduction of new processes, materials and tools where appropriate, in cooperation with external partners
• Qualification and characterization of used materials/supplies
• Cooperation with tool manufacturers, universities, and research facilities

Qualifications

• Master’s degree in Mechanical, Chemical or Electrical Engineering, Microsystems Technology, Materials Science, Physics or Chemistry; PhD is advantageous
• 2-3 years minimum hands-on experience working in the semiconductor industry in CMP or mechanical treatment of wafer, wafer thinning or similar industrial technology – optoelectronics, lenses (polishing with slurries, optics industry also comparable)). Clean room experience
• Knowledge of semiconductor materials usage
• Physical understanding of wafer fabrication processing techniques and tools; knowledge in relevant analytical methods, metrology tools and techniques
• Strong communication skills; ability to work in a team; analytical thinking and creativity
• Very good knowledge of English and German (intermediate German is a minimum)
• Willingness to travel