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Chip Grinding and Polishing Process Development Engineer – Semiconductor (d/m/f)

Job Title
Chip Grinding and Polishing Process Development Engineer – Semiconductor (d/m/f)
Job ID
27693383
Location
Regensburg, Bavaria, GERMANY,  BY 93055
Other Location
Description
Our multinational client, a leader in the manufacture of optoelectronic components, is in search of experts for their headquarters in Germany, specifically:
Chip Grinding and Polishing Process Development Engineer  – Semiconductor Chip

Tasks and Responsibilities:

  • Proactive process development of optoelectronic components with a focus on damage-free grinding and polishing of wafers
  • Support of chip development projects from small-scale tests up to the introduction of the optimized processes into high-volume production
  • Process improvements on existing production tools, including the evaluation and introduction of new processes, materials, and equipment - also in cooperation with equipment manufacturers
  • Development of cost-effective, automated, and robust processes for high-volume production
  • Qualification and characterization of the materials and process media

Qualifications

  • Masters degree in material science, physics, chemistry, microsystems technology or comparable, PhD is an advantage
  • Professional experience in an industrial environment, such as the semiconductor industry, advantageous
  • Strong physical and chemical understanding of semiconductor processes (wafer processing) and knowledge of relevant analytical methods
  • Knowledge of wafer thinning, CMP, tape processes or mechanical/chemical treatment of wafers is an advantage
  • Excellent communication and team skills, analytical thinking, and creativity
  • Very good knowledge of English and German (intermediate German is a minimum)
  • Willingness for occasional travel
Required Skills

Master’s degree in Materials Science, Physics, Chemistry or comparable
Professional exp in semiconductors, wafer fabrication processes and analytical methods
Knowledge in wafer processing, wafer thinning, CMP, tape processes
exp with wafer fabrication processing techniques and tools
English & German language proficiency
Openings
1

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